Suggested applications include wire
bonders, printing machines, bench tops, tabletop scales, collaborative robots, inspection and testing machines, lab equipment, human machine interfaces, and similar small machines and equipment.
HEATCON Composite Systems provides a full range of hot
bonders, accessories, technical and training services, and materials for the repair of composite structures.
The company says it has developed a new range of Universal Structural
Bonders whose many attributes have been achieved through new, patented hybrid technology and this innovative approach substantially extends the application scope of these adhesives which also afford improved health and safety benefits.
Automation Tools ASM Assembly Systems (Siplace Bulkfeeder X)
Bonders Palomar Technologies (3880 Die
Bonder) Coatings/Encapsulants Aculon (NanoProof PCB Repellency) Cleaning Equipment Seika Machinery (Unitech UC-250M-CV PCB Board Cleaner) Cleaning Materials Kyzen (Aquanox A8820) Component Placement--High Speed Fuji America (LCR Unit) Component Placement--Multifunction Kurtz Ersa (Ersa Roboplace) Component Storage Inovaxe (InoAuto Smart Cart) Device Programming Data I/O (LumenX) Dispensing Equipment Techcon Systems (TS5624 Disposable Diaphragm Valve) Process Control Tools Seika Machinery (RCX Series Modular Reflow Oven Profiling System) Rework & Repair Tools BEST Inc.
Founded in 1982, Prime Resins Inc formulates and manufactures epoxy injection resins, floor coatings,
bonders, binders, and polyurethane chemical grouts.
(Military service should be made to attract only a small percentage of baby
bonders, because the last thing our generals want or need is a huge number of untrained short-timers to put up with.
Desktop
bonders can be used for assembling medical devices, cellular phones, on-board computers, LCD monitors, laptops, and cockpit instrumentation and displays.
Sonobond's ultrasonic
bonders are available in plunge and continuous form to seal, sew, and/or trim--all in one quick pass.
With the launch of the new tool SUSS MicroTec said that it now supplements its product suite of wafer
bonders and lithography equipment for 3D integration.
In addition to its dominant share of the market for wafer
bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS.
Wire
bonders have pattern recognition capabilities essential to modern electronics manufacturing.